Premium Interconnect Solutions

VULCON™ IP67/IP68 Circular Connectors

Future of Circular Connector Technology

Example Applications:
  • Electronics Manufacturing
  • Industrial Automation
  • Robotics
  • Industrial Machinery
  • Process Control Systems

 
seal-d ip67 connectors

...with DEFCON 1 Sealing Technology

NorComp has developed IP67 / IP68 SEAL-D® waterproof d-sub connectors that utilize a proprietary sealing technology, which maintains the same physical size and footprint as standard d-sub products.

 
QUIK-LOQ™ push pull connectors

Push Pull Connector Systems

QUIK-LOQ Metal Shell & Plastic Shell Push-Pull Circular Connectors deliver a compact high performance solution engineered to withstand shock and high vibration both indoors and outdoors in harsh environments.

 
circular connectors featured

Machined Connector Performance

M-SERIES D-Subconnectors are designed for rugged/robust applications including medical,industrial,and aerospace. Featuring “SolidPin” machined contacts,these connectors offer high-reliability performance for the most challenging design applications.

 
armor backshells featured

Ruggedized Backshell Systems

ARMOR Die-Cast metal-shell d-sub backshell housings are plated with high quality nickel and undercoated with copper to provide excellent EMI/RFI shielding for the most demanding end-use applications.

 
MICRO-D connectors featured

Micro Miniature Connector Technology

MICRO-D d-sub connectors and cable assemblies are designed for commercial applications where space is at a premium such as instrumentation & industrial robotics equipment. This space saving footprint & highly-reliable shielded micro-miniature design is available in 3 industry standard sizes (9, 15, 25) and mates with most commercial competitor micro d-sub products.

 
power-d connectors featured

Peak Capacity Performance

The POWER-D & Combo-D mixed contact connectors are designed for demanding applications where a single connector is required for both power & signal. The solid machined contacts offer extremely reliable transfer of signal in a condensed footprint solution.