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680 Series IP66 Solder Cup High Density D-Subs

SEAL-D®

Features

  • D-Sub Solder Cup High Density in 3 industry sizes/positions:
    • High Density (15 pin, 26 pin, 44 pin) Male/Plug Only
  • Meets IEC-529-IP66 Requirements.
  • Unique sealing method maintains HD D-Sub profile allowing drop in replacement of current HD D-Sub connectors.
  • Panel sealing kits (Removable or Permanent) Available
    - Must be purchased separately.
  • Non-Removable Contacts
  • Available with 4 hardware options.
 

Materials

  • Shell: Steel, Nickel Plated
  • Insulator: Glass-filled thermoplastic. U.L. rated 94V-O
    (230°C process temp)
  • Stamped contacts: Male pins - BrassRoHS-LOGO.png
  • Plating:Gold flash on entire contact
    (contact factory for other plating options)
 

Notes

Panel Cutout: yy = Hardware Option
 
 
Video: w9La6JPN5JA

High Density Solder Cup D-Sub Connectors - IP66 Rated

Position

Part #

Gender

Shell

Data Sheet

IGES

STEP

3D PDF

15 680-015-103Lyy1 Male Nickel
26 680-026-103Lyy1 Male Nickel
44 680-044-103Lyy1 Male Nickel

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